Building on the success of the MIPS we have developed PIP to provide analysis of additional well integrity measurements on a common platform.
PIP is a new software platform developed for our next generation of pipe integrity products. Building on the success of MIPS, we have expanded the technical capabilities to handle a range of additional sensors including cement bond logs, noise logs and other station data. The PIP development includes a new viewer for integrated analysis and display of multiple sensor data and an enhanced DLIS importer. PIP technology has also allowed us to build customised plugins for clients with unique cased hole logging sensors that require processing, analysis and reporting software.
The ability to simultaneously display multiple sensors proves useful when more than one instrument is used to diagnose well integrity conditions. The example above shows how Cement Bond Log, Multi Finger Caliper and pipe Thickness data acquired over the same interval can be viewed and reported simultaneously. An overview of the condition of three of the primary well barriers - cement, casing and tubing - is provided in this single view.
A further PIP image below showing multiple array data sets from different sensors and at different stages of processing from GOWell’s MTD instrument. Also displayed in the two right hand tracks are processed wall thickness results presented as both continuous curves and graded against depth based on user defined thickness thresholds. For convenience these results are superimposed on a three tubular well schematic.
Illustrated in the example array bond log presentation below features of the new viewer include the ability to add up to 20 log tracks, display curve, waveform and various array data sets, a well schematic utility, upgraded depth tracks that can be user positioned and improved curve header details. Data tracks may be re-positioned and re-sized as required.
Currently in ‘beta test’ PIP supports the input, viewing, processing and output of Multifinger Caliper, Thickness, Noise, array and conventional Cement Bond Logs, Camera and other images, various stationary measurements and any customer specific sensor (please contact us with specific requests).
3D viewing, plotting, annotations, delivery with a license free viewer and other familiar MIPS utilities have been adapted and ported into PIP. Algorithms for analysis of Cement Bond Logs are in development and this module will be available in the first production release.
Support and development of MIPS will continue for users requiring only caliper and thickness analysis and reporting functions.Make an Enquiry